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The electrostatic-alloy bonding technique used in MEMS
WANG Wei, CHEN Wei-ping
Frontiers of Mechanical Engineering 2006, Volume 1, Issue 2, Pages 238-241 doi: 10.1007/s11465-006-0011-5
Keywords: Si/Au-glass strength MEMS packaging process sandwich structure
Wang Weiyuan,Wang Yuelin
Strategic Study of CAE 2002, Volume 4, Issue 6, Pages 56-62
The packaging of micro electro mechanical systems (MEMS) is referred to first-level packaging andThe very high importance not to forget packaging at the beginning of a project, when hoping to industrializeMEMS is discussed.
Keywords: packaging of MEMS bulk silicon bonding technology film-sealed technology
Special issue: Micro-electromechanical systems (MEMS)
Zhuangde JIANG
Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4, Pages 457-458 doi: 10.1007/s11465-017-0492-4
Frontiers of Chemical Science and Engineering 2023, Volume 17, Issue 6, Pages 704-715 doi: 10.1007/s11705-022-2270-z
Keywords: bio-based multifunction colorimetric indicator active and intelligent packaging
ENVIRONMENTAL ATTITUDES AND CONSUMER PREFERENCE FOR ENVIRONMENTALLY-FRIENDLY BEVERAGE PACKAGING: THE
Frontiers of Agricultural Science and Engineering 2023, Volume 10, Issue 1, Pages 95-108 doi: 10.15302/J-FASE-2022478
● Consumer preference for environmentally-friendly beverage packaging
Keywords: China consumer preference food and beverage packaging green identity label information treatment
Additive direct-write microfabrication for MEMS: A review
Kwok Siong TEH
Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4, Pages 490-509 doi: 10.1007/s11465-017-0484-4
Keywords: direct-write additive manufacturing microfabrication MEMS
Review of MEMS differential scanning calorimetry for biomolecular study
Shifeng YU, Shuyu WANG, Ming LU, Lei ZUO
Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4, Pages 526-538 doi: 10.1007/s11465-017-0451-0
Keywords: differential scanning calorimetry biomolecule MEMS thermodynamic
Thermal and catalytic pyrolysis of a synthetic mixture representative of packaging plastics residue
Simona Colantonio, Lorenzo Cafiero, Doina De Angelis, Nicolò M. Ippolito, Riccardo Tuffi, Stefano Vecchio Ciprioti
Frontiers of Chemical Science and Engineering 2020, Volume 14, Issue 2, Pages 288-303 doi: 10.1007/s11705-019-1875-3
Keywords: packaging plastics waste plasmix pyrolysis zeolite catalyst degradation temperature
MEMS-based thermoelectric infrared sensors: A review
Dehui XU, Yuelin WANG, Bin XIONG, Tie LI
Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4, Pages 557-566 doi: 10.1007/s11465-017-0441-2
In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensorsThis paper presents a review of MEMS-based thermoelectric IR sensors.second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging
Keywords: thermoelectric infrared sensor CMOS-MEMS thermopile micromachining wafer-level package
Frontiers of Mechanical Engineering 2023, Volume 18, Issue 2, doi: 10.1007/s11465-023-0747-1
Keywords: micro-electro-mechanical system capacitive sensor bionics operation instability mechanical and electrical decoupling biomedical force measurement
Research of MEMS and Development of One-chip RF - MEMS
Zhong Xianxin,Yu Wenge,Li Xiaoyi,Wu Zhengzhong,Liu Jixue,Chen Shuai,Shao Xiaoliang
Strategic Study of CAE 2004, Volume 6, Issue 7, Pages 21-25
Keywords: microsystem integration one-chip wireless communication system
Ming-jun MA,Zhong-he JIN,Hui-jie ZHU
Frontiers of Information Technology & Electronic Engineering 2015, Volume 16, Issue 6, Pages 497-510 doi: 10.1631/FITEE.1400349
Keywords: Bias drift Closed-loop MEMS accelerometer Modulated feedback approach Temperature compensation
Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs) Research Article
Zhen FANG, Jihua ZHANG, Libin GAO, Hongwei CHEN, Wenlei LI, Tianpeng LIANG, Xudong CAI, Xingzhou CAI, Weicong JIA, Huan GUO, Yong LI,zhenfang@std.uestc.edu.cn,jhzhang@uestc.edu.cn
Frontiers of Information Technology & Electronic Engineering 2023, Volume 24, Issue 6, Pages 916-926 doi: 10.1631/FITEE.2200573
Keywords: Filtering packaging antenna (FPA) Through-glass vias (TGVs) 3D packaging devices Laser bonding
Development and application of high-end aerospace MEMS
Weizheng YUAN
Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4, Pages 567-573 doi: 10.1007/s11465-017-0424-3
Keywords: MEMS design and manufacture technology aeronautic and aerospace
The road to sustainable use and waste management of plastics in Portugal
Frontiers of Environmental Science & Engineering 2022, Volume 16, Issue 1, Pages 5-5 doi: 10.1007/s11783-021-1439-x
• Portugal recycles 34% of the 40 kg/hab year of plastic packaging waste
Keywords: Single-use plastics Plastic packaging Plastic waste Waste management Waste shipment Lightweight
Title Author Date Type Operation
Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology
Wang Weiyuan,Wang Yuelin
Journal Article
Anthocyanins/chitosan films doped by nano zinc oxide for active and intelligent packaging: comparison
Journal Article
ENVIRONMENTAL ATTITUDES AND CONSUMER PREFERENCE FOR ENVIRONMENTALLY-FRIENDLY BEVERAGE PACKAGING: THE
Journal Article
Review of MEMS differential scanning calorimetry for biomolecular study
Shifeng YU, Shuyu WANG, Ming LU, Lei ZUO
Journal Article
Thermal and catalytic pyrolysis of a synthetic mixture representative of packaging plastics residue
Simona Colantonio, Lorenzo Cafiero, Doina De Angelis, Nicolò M. Ippolito, Riccardo Tuffi, Stefano Vecchio Ciprioti
Journal Article
MEMS-based thermoelectric infrared sensors: A review
Dehui XU, Yuelin WANG, Bin XIONG, Tie LI
Journal Article
A bionic approach for the mechanical and electrical decoupling of an MEMS capacitive sensor in ultralow
Journal Article
Research of MEMS and Development of One-chip RF - MEMS
Zhong Xianxin,Yu Wenge,Li Xiaoyi,Wu Zhengzhong,Liu Jixue,Chen Shuai,Shao Xiaoliang
Journal Article
combined modulated feedback and temperature compensation approach to improve bias drift of a closed-loop MEMS
Ming-jun MA,Zhong-he JIN,Hui-jie ZHU
Journal Article
Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)
Zhen FANG, Jihua ZHANG, Libin GAO, Hongwei CHEN, Wenlei LI, Tianpeng LIANG, Xudong CAI, Xingzhou CAI, Weicong JIA, Huan GUO, Yong LI,zhenfang@std.uestc.edu.cn,jhzhang@uestc.edu.cn
Journal Article